Intel Releases USB 3.0 Controller Interface Spec (xHCI)

We have been hearing about the new, higher speed USB 3.0 interface for a long time now. The new USB 3.0 specification promises 4.8Gbps "SuperSpeed" data transfers, and will leave the current USB 2.0 specification in the dust. Intel has finally provided the open host controller specifications for USB 3.0, offered free to rival chipset and add-on card makers. You may remember back in June, several chipset makers who compete with Intel - namely AMD and nVidia - alleged that the chip giant had working specifications for the USB 3.0 controller and was simply holding the specifications back to give itself a market advantage.

Intel was quick to deny that it was holding back the open host controller specifications, and simply said they weren't ready. That didn't stop AMD, nVidia, VIA, and SiS from announcing a few days later that they were teaming up to form their own open host controller specification for USB 3.0. It remains to be seen how far along with the development of a competing USB 3.0 open host controller specification by nVidia and its partners moved before Intel officially launched its specification. You have to believe that Intel rival group could not have gotten far on their own specification at this point. It's also important to note that VIA has announced it is getting out of chipset business altogether.

Intel has decided to call the USB 3.0 open host controller specification xHCI, short for Extensible Host Controller Interface. There's a very slim chance that Intel's specification will not become the standard for USB 3.0 controllers. AMD, Microsoft, NEC, and Dell have all announced that they will be basing products on Intel's parameters. NEC has specifically announced that its USB 3.0 devices will be tested for compatibility with xHCI. There's little doubt that Intel has a significant lead on other people using the new open host specifications. While Intel has not admitted it, its internal groups have surely known about the specifications for several months. This would give them a significant lead to market for USB 3.0 devices and chipsets.